The Union Cabinet, chaired by Prime Minister Narendra Modi, on Tuesday approved four new semiconductor projects under the India Semiconductor Mission. These approvals follow six previously sanctioned projects currently in various stages of implementation.
The new projects include the nation’s first commercial compound fabrication facility and an advanced glass-based substrate semiconductor packaging unit.
According to the government, these facilities will strengthen India’s growing semiconductor capabilities, supporting chip design initiatives in 278 academic institutions and 72 start-ups. They aim to meet the rising semiconductor demand across telecom, automotive, data centres, consumer electronics, and industrial applications.
The four newly approved proposals come from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies.
Combined, these projects will involve investments of approximately ₹4,600 crore and are projected to generate employment for 2,034 skilled professionals, along with indirect opportunities across the electronics manufacturing sector.
With these approvals, India now has ten ISM-sanctioned projects across six states, totalling around ₹1.60 lakh crore in investments. Odisha will host SiCSem and 3D Glass facilities, CDIL will expand in Punjab, and ASIP will operate in Andhra Pradesh.
Project Highlights & Production Capacities
SiCSem, in collaboration with Clas-SiC Wafer Fab Ltd., UK, is establishing India’s first integrated Silicon Carbide (SiC) Compound Semiconductors facility in Info Valley, Bhubaneshwar, Odisha.
The unit will produce 60,000 wafers annually and package 96 million units, serving sectors including defence, EVs, railways, fast chargers, data centres, consumer appliances, and solar power inverters.
3D Glass Solutions Inc will develop an advanced packaging and embedded glass substrate facility also in Info Valley, Bhubaneshwar.
The unit will produce 69,600 glass panel substrates, 50 million assembled units, and 13,200 3D Heterogeneous Integration (3DHI) modules annually, supporting defence, high-performance computing, AI, RF, automotive, photonics, and co-packaged optics applications.
ASIP Technologies will establish a semiconductor production facility in Andhra Pradesh in collaboration with South Korea’s APACT Co Ltd, targeting 96 million units annually for mobile phones, set-top boxes, automotive components, and other electronic devices.
CDIL will expand its existing discrete semiconductor unit in Mohali, Punjab, producing high-power MOSFETs, IGBTs, Schottky diodes, and transistors using both Silicon and Silicon Carbide, aiming for an annual output of 158.38 million units.
These will serve automotive electronics, EV infrastructure, renewable energy, power conversion, industrial applications, and communication infrastructure.
These projects reflect India’s push for Atmanirbhar Bharat in technology manufacturing, enhancing the domestic semiconductor ecosystem, supporting skilled employment, and fostering innovation across critical sectors.
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