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Prime Minister Narendra Modi is scheduled to visit Rajasthan and Gujarat on Saturday to launch a wide range of development projects aimed at strengthening transport, energy, urban infrastructure and semiconductor manufacturing.
The visit will include the inauguration and foundation laying of projects with a combined value of around ₹1.06 lakh crore.
Following his engagements in Rajasthan, the Prime Minister will travel to Gujarat to inaugurate one of India’s pioneering semiconductor assembly and testing facilities.
Rajasthan Visit
The Prime Minister will begin his visit in Jodhpur at around 10:45 AM, where he will open the city’s new airport terminal building and introduce the revamped aviation scheme. He will then proceed to Balotra to dedicate several completed projects, launch new initiatives and interact with the public at a rally.
As part of the programme, PM Modi will also lay the foundation stone for Jaipur Metro Rail Phase-2 during the inauguration of the Hindustan Petroleum Corporation Limited (HPCL) Refinery at Pachpadra.
The metro expansion, estimated to cost ₹13,037 crore, will develop a 41-kilometre North-South corridor linking Prahladpura and Todi Mod.
The line will improve connectivity to Jaipur International Airport, industrial hubs, Jaipur Railway Station, Sawai Man Singh Hospital, Sawai Man Singh Stadium and several important commercial and residential neighbourhoods.
Rajasthan Metro Rail Corporation Limited (RMRCL), a joint venture between the Central and Rajasthan governments, will construct the new corridor with 36 metro stations.
Gujarat Visit
After completing his Rajasthan itinerary, PM Modi will arrive in Sanand, Gujarat, at around 4:30 PM to inaugurate the CG Semi Outsourced Semiconductor Assembly and Test (OSAT) plant before addressing a gathering.
Developed with an investment of more than ₹7,500 crore under the India Semiconductor Mission, the facility ranks among the country’s first semiconductor assembly and testing units. It will offer integrated services ranging from wafer sorting and chip assembly to testing, package design, product characterisation, failure analysis and logistics, reinforcing India’s ambition to become a global semiconductor manufacturing hub.
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