
Izmomicro, the specialised division of Izmo, has announced the development of a high-density silicon photonics packaging platform, marking a major milestone for India in next-generation semiconductor technologies.
The company said the innovation will boost artificial intelligence (AI), cloud computing, and future telecom networks.
Izmomicro has created a high-density silicon photonics packaging platform. It supports 32-channel fibre input and output and achieves an industry-leading insertion loss of less than 2 dB.
The company highlighted that reaching this density posed a significant challenge. It required nanometer-level optical alignment, advanced assembly techniques, and seamless electronics integration.
The module integrates 32 DC and 4 RF input/outputs, delivering high-speed RF performance up to 70 GHz and setting a new benchmark in system integration.
Silicon Photonics Replaces Copper for High-Speed Data
With copper interconnects reaching physical limits, silicon photonics is emerging as the core technology for multi-terabit optical communication.
Izmomicro said its breakthrough overcomes key packaging challenges. It enables scalability and efficiency for hyperscale data centres, AI clusters, and next-generation 5G and 6G networks.
Dinanath Soni, Executive Director of Izmomicro, stated, “Only a handful of companies worldwide have demonstrated this capability, and we are proud to be the first in India. This breakthrough validates our years of R&D in precision packaging and positions us as a critical partner for the global silicon photonics industry. As AI and data-driven applications demand ever-higher performance, our innovation will help power the infrastructure of the future.”
Silicon Photonics Market Set for Rapid Growth
The global silicon photonics market, valued at $2.65 billion in 2025, is projected to grow at a compound annual growth rate of over 25% by 2030.
The demand for faster, energy-efficient data transmission in cloud platforms, AI systems, and telecom networks will fuel this growth.
Izmomicro said its latest innovation positions the company to capture a significant share of this growing market. It also supports India’s semiconductor ambitions under the Make in India initiative.
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