PM Modi To Commission Micron’s Rs 22,516-Crore Semiconductor Plant In Sanand

Prime Minister Narendra Modi is scheduled to inaugurate the semiconductor Assembly, Testing, Marking and Packaging (ATMP) plant in Sanand for the nation on February 28. The commissioning of the unit represents a notable milestone in India’s drive to expand its semiconductor manufacturing base.

Developed by Micron Semiconductor Technology India Pvt Ltd, the project has attracted an investment of Rs 22,516 crore.

The plant will handle the assembly and testing of memory components such as solid state drives, DRAM and NAND devices, which will be supplied to international customers.

At present, approximately 2,000 personnel are employed at the site.

Company officials have indicated that the workforce will gradually increase, creating nearly 5,000 direct employment opportunities in the coming years. They also confirmed that individuals with disabilities have been engaged in technical and operational roles, reflecting an inclusive hiring approach.

The Gujarat government has stated that the project was executed within the scheduled timeframe. It said the development reinforces the state’s ambition to emerge as a prominent semiconductor manufacturing centre in India.

Micron CEO Highlights Role of Memory in AI

Micron Technology President and Chief Executive Officer Sanjay Mehrotra underscored the strategic importance of advanced memory and storage solutions.

“In today’s technological era, particularly in Artificial Intelligence, memory and storage play a crucial role. Without strong memory and storage support, AI systems cannot function properly,” he stated.

He observed that AI-driven applications rely heavily on robust memory infrastructure and that demand for such capabilities is accelerating.

The semiconductor manufacturing chain begins with the extraction of silicon from sand, followed by the creation of ingots and wafers.

Engineers process these wafers in fabrication facilities, where they embed complex circuitry before cutting them into individual chips. They then transport the chips to the Sanand ATMP unit for assembly, comprehensive testing, marking and packaging.

The facility will convert advanced DRAM and NAND wafers sourced from Micron’s global operations into finished memory products, supporting worldwide demand for high-performance computing and AI technologies.

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